Items where Author is "Gomez, F. R."

Sumagpang Jr., A. and Gomez, F. R. and Bacquian, B. C. (2020) Wafer Saw Process Optimization for Die Chipping Mitigation on Extremely Small Leadframe Package. Journal of Engineering Research and Reports, 12 (3). pp. 25-29. ISSN 2582-2926

Jr., A. Sumagpang and Gomez, F. R. and Rodriguez, R. (2020) Tool Setup Improvement for Package Scratch Mitigation at End-of-Line Process. Journal of Engineering Research and Reports, 12 (3). pp. 1-5. ISSN 2582-2926